Xinhuan Niu - Concepedia

Author

Xinhuan Niu

Hebei University of Technology ORCID

Also Known As

Cuie Zhang, Feng You, Niu, Xin, X.H. Niu, Xin Huan Niu, Xin Niu, Xin-huan NIU, Xin-huan Niu, XinHuan Niu, Xinhuan Niu

169

Publications

3.1K

Citations

H-Index

Concepts

All Affiliations

Hebei University of Technology Tianjin University of Technology Institute of Microelectronics Shijiazhuang University Hebei University of Science and Technology

About

Xinhuan Niu is an author at Hebei University of Technology specializing in engineering, materials science, and chemical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	26	49	1.6K
2	Chemical Engineering	23	38	1.4K
3	Applied Physics	10	10	254
4	Medicine	1	1	19
5	Natural Sciences	1	1	48

Xinhuan Niu

Publications

1.7K

Citations

H-Index

Page 1

	Year	Citations
Study on the film forming mechanism, corrosion inhibition effect and synergistic action of two different inhibitors on copper surface chemical mechanical polishing for GLSI Jiakai Zhou, Xinhuan Niu, Yaqi Cui, Applied Surface Science Materials EngineeringMaterials ScienceChemical EngineeringCorrosion ProtectionCorrosion Inhibition Effect	2019	132
Surface action mechanism and planarization effect of sarcosine as an auxiliary complexing agent in copper film chemical mechanical polishing Jiakai Zhou, Xinhuan Niu, Chenghui Yang, Applied Surface Science Materials ScienceChemical EngineeringAuxiliary Complexing AgentEngineeringSurface Functionalization	2020	88
Effect of a novel chelating agent on defect removal during post-CMP cleaning J. M. Hong, Xinhuan Niu, Yuling Liu, Applied Surface Science Chemical EngineeringEngineeringDecontaminationEnvironmental EngineeringWater Treatment	2016	87
Roles and mechanism analysis of chitosan as a green additive in low-tech node copper film chemical mechanical polishing Jiakai Zhou, Xinhuan Niu, Zhi Wang, Colloids and Surfaces A Physicochemical and Engineering Aspects Materials ScienceMaterials EngineeringChemical EngineeringEngineeringMaterial Processing	2019	74
Preparation of MgO doped colloidal SiO2 abrasive and their chemical mechanical polishing performance on c-, r- and a-plane sapphire substrate Da Yin, Xinhuan Niu, Kai Zhang, Ceramics International Materials ScienceMaterials EngineeringChemical EngineeringEngineeringCorrosion	2018	71
A review: research progress of chemical–mechanical polishing slurry for copper interconnection of integrated circuits Han Yan, Xinhuan Niu, Minghui Qu, The International Journal of Advanced Manufacturing Technology Materials ScienceCopper InterconnectionChemical EngineeringEngineeringMaterial Processing	2023	58
Theoretical and electrochemical analysis on inhibition effect of benzotriazole and 1,2,4-triazole on cobalt surface Da Yin, Yang Liu, Xinhuan Niu, Colloids and Surfaces A Physicochemical and Engineering Aspects Inorganic ChemistryChemical EngineeringCobalt SurfaceEngineeringElectrochemical Analysis	2020	50
Surface corrosion inhibition mechanism of sarcosine as a green novel inhibitor on a novel barrier layer material of cobalt in copper film CMP for GLSI Yinchan Zhang, Xinhuan Niu, Jiakai Zhou, Materials Science in Semiconductor Processing Materials EngineeringMaterials ScienceCorrosion ProtectionEngineeringCorrosion	2021	50
Corrosion inhibition mechanisms of triazole derivatives on copper chemical mechanical polishing: Combined experiment and DFT study Jianghao Liu, Xinhuan Niu, Yingqian Jia, Applied Surface Science Materials ScienceChemical EngineeringCorrosion ProtectionEngineeringCorrosion	2024	49
Study on the Weakly Alkaline Slurry of Copper Chemical Mechanical Planarization for GLSI Caihong Yao, Xinhuan Niu, Chenwei Wang, ECS Journal of Solid State Science and Technology EngineeringMechanical EngineeringChemistryMineral ProcessingWeakly Alkaline Slurry	2017	48

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