Yaqi Cui

Study on the film forming mechanism, corrosion inhibition effect and synergistic action of two different inhibitors on copper surface chemical mechanical polishing for GLSI

Jiakai Zhou, Xinhuan Niu, Yaqi Cui et al. · Applied Surface Science · 2019 · 132 citations

Materials Engineering, Materials Science, Chemical Engineering +12

Surface action mechanism and planarization effect of sarcosine as an auxiliary complexing agent in copper film chemical mechanical polishing

Jiakai Zhou, Xinhuan Niu, Chenghui Yang et al. · Applied Surface Science · 2020 · 88 citations

Materials Science, Chemical Engineering, Auxiliary Complexing Agent +11

Roles and mechanism analysis of chitosan as a green additive in low-tech node copper film chemical mechanical polishing

Jiakai Zhou, Xinhuan Niu, Zhi Wang et al. · Colloids and Surfaces A Physicochemical and Engineering Aspects · 2019 · 74 citations

Materials Science, Materials Engineering, Chemical Engineering +7

Preparation of MgO doped colloidal SiO2 abrasive and their chemical mechanical polishing performance on c-, r- and a-plane sapphire substrate

Da Yin, Xinhuan Niu, Kai Zhang et al. · Ceramics International · 2018 · 71 citations

Materials Science, Materials Engineering, Chemical Engineering +9

Chemical Interactions and Mechanisms of Different pH Regulators on Copper and Cobalt Removal Rate of Copper Film CMP for GLSI

Jiakai Zhou, Jianchao Wang, Xinhuan Niu et al. · ECS Journal of Solid State Science and Technology · 2019 · 41 citations · Full text

Engineering, Integrated Circuits, Chemistry +16