Chenghui Yang

Surface action mechanism and planarization effect of sarcosine as an auxiliary complexing agent in copper film chemical mechanical polishing

Jiakai Zhou, Xinhuan Niu, Chenghui Yang et al. · Applied Surface Science · 2020 · 88 citations

Materials Science, Chemical Engineering, Auxiliary Complexing Agent +11

Roles and mechanism analysis of chitosan as a green additive in low-tech node copper film chemical mechanical polishing

Jiakai Zhou, Xinhuan Niu, Zhi Wang et al. · Colloids and Surfaces A Physicochemical and Engineering Aspects · 2019 · 74 citations

Materials Science, Materials Engineering, Chemical Engineering +7

Surface corrosion inhibition mechanism of sarcosine as a green novel inhibitor on a novel barrier layer material of cobalt in copper film CMP for GLSI

Yinchan Zhang, Xinhuan Niu, Jiakai Zhou et al. · Materials Science in Semiconductor Processing · 2021 · 50 citations

Materials Engineering, Materials Science, Corrosion Protection +10

Effect of Potassium Persulfate as an Additive On Chemical Mechanical Polishing Performance on C-, A- and R-Plane Sapphire

Yanan Lu, Xinhuan Niu, Chenghui Yang et al. · ECS Journal of Solid State Science and Technology · 2020 · 28 citations · Full text

Materials Science, Materials Engineering, Chemical Engineering +14

Synergistic Action Mechanism and Effect of Ammonium Dodecyl Sulfate and 1,2,4-triazole in Alkaline Slurry on Step Height Reduction for Cu CMP

Chenghui Yang, Xinhuan Niu, Jiakai Zhou et al. · ECS Journal of Solid State Science and Technology · 2020 · 26 citations · Full text

Background Slurry, Engineering, Cu Cmp +17