A. Opdebeeck

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology

Geert Van der Plas, Paresh Limaye, Igor Loi et al. · IEEE Journal of Solid-State Circuits · 2010 · 308 citations

Engineering, Vlsi Design, 3-D Chip Stacks +17

3D stacked IC demonstration using a through Silicon Via First approach

J. Van Olmen, A. Mercha, Guruprasad Katti et al. · 2008 · 141 citations

Engineering, Silicon Vias, Oscillator Topologies +18

The IMEC clean : A new concept for particle and metal removal on Si surfaces

Marc Meuris, Paul Mertens, A. Opdebeeck et al. · 1995 · 125 citations

Materials Science, Materials Engineering, Imec Clean +12

Design issues and considerations for low-cost 3D TSV IC technology

Geert Van der Plas, Paresh Limaye, A. Mercha et al. · 2010 · 61 citations

Engineering, Vlsi Design, Computer Architecture +16

First Demonstration of Vertically Stacked Gate-All-Around Highly Strained Germanium Nanowire pFETs

E. Capogreco, Liesbeth Witters, Hiroaki Arimura et al. · IEEE Transactions on Electron Devices · 2018 · 59 citations

Semiconductor Technology, Electrical Engineering, Engineering +13