K. Wandel

Determination of the mechanical stress in plasma enhanced chemical vapor deposited SiO2 and SiN layers

P. Ambrée, F. Kreller, R.M. Wolf et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 1993 · 44 citations

Engineering, Mechanical Engineering, Thin Film Process Technology +20

Ag films grown by remote plasma enhanced atomic layer deposition on different substrates

Akinwumi A. Amusan, Bodo Kalkofen, Hassan Gargouri et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2015 · 22 citations

Engineering, Metallic Nanomaterials, Thin Film Process Technology +16

Low-temperature ICPECVD of silicon nitride in SiH4–NH3–Ar discharges analyzed by spectroscopic ellipsometry and etch behavior in KOH and BHF

Rainer Wolf, K. Wandel, Bernd Gruska · Surface and Coatings Technology · 2001 · 20 citations

Low-temperature Icpecvd, Electrical Engineering, Engineering +8

An inductively coupled miniature plasma jet source at microwave frequencies

Horia‐Eugen Porteanu, Roland Gesche, K. Wandel · Plasma Sources Science and Technology · 2013 · 14 citations

Electron Density, Electrical Engineering, Copper Resonator +13

Acceptor diffusion across InGaAs/InP heterointerfaces

P. Ambrée, A. Hangleiter, M. H. Pilkuhn et al. · Applied Physics Letters · 1990 · 12 citations

Engineering, Semiconductor Nanostructures, Semiconductors +16