Sharon Lim Pei Siang

Development of Fine Pitch Solder Microbumps for 3D Chip Stacking

Aibin Yu, Aditya Kumar, Soon Wee Ho et al. · 2008 · 28 citations

Engineering, Mechanical Engineering, Ultra Fine Pitch +20

Active Through-Silicon Interposer Based 2.5D IC Design, Fabrication, Assembly and Test

J. Jayabalan, Vivek Chidambaram, Sharon Lim Pei Siang et al. · 2019 · 18 citations

Engineering, Vlsi Design, Active Interposer +17

A Novel Packaging Platform for High-Performance Optical Engines in Hyperscale Data Center Applications

Sajay Bhuvanendran Nair Gourikutty, Ming Chinq Jong, Chockanathan Vinoth Kanna et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 17 citations

Engineering, Device Integration, Integrated Photonics +22

Double Mold Antenna in Package for 77 GHz Automotive Radar

Soon Wee Ho, Soh Siew Boon, Lau Boon Long et al. · 2020 · 15 citations

Heterogeneous Integration with Embedded Fine Interconnect

Chai Tai Chong, Lim Teck Guan, David Ho et al. · 2021 · 14 citations

Engineering, Device Integration, Mechanical Engineering +18