L.W. Schaper

Process integration for through-silicon vias

S. Spiesshoefer, Zia Ur Rahman, G. Vangara et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2005 · 77 citations

Process Integration, Engineering, Device Integration +19

Architectural implications and process development of 3-D VLSI Z-axis interconnects using through silicon vias

L.W. Schaper, S. L. Burkett, S. Spiesshoefer et al. · IEEE Transactions on Advanced Packaging · 2005 · 65 citations

Engineering, Silicon Vias, Process Development +21

Reliability study of through-silicon via (TSV) copper filled interconnects

A. Kamto, Y. Liu, L.W. Schaper et al. · Thin Solid Films · 2009 · 48 citations

Reliability, Electrical Engineering, Reliability Study +6

A preliminary investigation of the effect of post-deposition polishing of diamond films on the machining behavior of diamond-coated cutting tools

Deepak Bhat, D.G. Johnson, Ajay P. Malshe et al. · Diamond and Related Materials · 1995 · 45 citations

Materials Science, Post-deposition Polishing, Engineering +10

Control of sidewall slope in silicon vias using SF6∕O2 plasma etching in a conventional reactive ion etching tool

R. F. Figueroa, S. Spiesshoefer, S. L. Burkett et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2005 · 45 citations

Engineering, Silicon Vias, Integrated Circuits +17