Reliability study of through-silicon via (TSV) copper filled interconnects - Concepedia

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Reliability study of through-silicon via (TSV) copper filled interconnects

48

Citations

11

References

2009

Year

A. Kamto, Y. Liu, L.W. Schaper, S. L. Burkett

Thin Solid Films

ReliabilityElectrical EngineeringReliability StudyEngineeringHardware ReliabilityElectronic PackagingDevice ReliabilityMicroelectronicsInterconnect (Integrated Circuits)

References

	Year	Citations

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