6
Publications
156
Citations
6
H-Index
2008
Active since
Y. Liu is an author at University of Arkansas at Fayetteville specializing in engineering, microelectronics, and genomics.
Top concepts
EngineeringGeneticsGenomicsMedicineMicroelectronicsElectronic PackagingElectrical EngineeringBiology3D PrintingReliability
Publications per year
2008–2025
6
6
Reliability study of through-silicon via (TSV) copper filled interconnects
A. Kamto, Y. Liu, L.W. Schaper et al. · Thin Solid Films · 2009 · 48 citations
Rows per page
1–5 of 6