A. Kamto

Reliability study of through-silicon via (TSV) copper filled interconnects

A. Kamto, Y. Liu, L.W. Schaper et al. · Thin Solid Films · 2009 · 48 citations

Reliability, Electrical Engineering, Reliability Study +6

Cryogenic inductively coupled plasma etching for fabrication of tapered through-silicon vias

A. Kamto, Ralu Divan, Anirudha V. Sumant et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2010 · 28 citations

Engineering, Integrated Circuits, Tapered Sidewall +20

Fabrication and testing of through-silicon vias used in three-dimensional integration

I. U. Abhulimen, A. Kamto, Y. Liu et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2008 · 28 citations

Engineering, Integrated Circuits, Silicon On Insulator +22

Effect of deep‐level states on current–voltage characteristics and electroluminescence of blue and UV light‐emitting diodes

R. Nana, Parameshwaran Gnanachchelvi, M. A. Awaah et al. · physica status solidi (a) · 2010 · 21 citations

Semiconductors, Deep States, Electrical Engineering +15