S. L. Burkett

A novel damage index for damage identification using guided waves with application in laminated composites

Shahab Torkamani, Samit Roy, Mark E. Barkey et al. · Smart Materials and Structures · 2014 · 106 citations

Delamination Type, Damage Index, Damage Mechanism +15

Process integration for through-silicon vias

S. Spiesshoefer, Zia Ur Rahman, G. Vangara et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2005 · 77 citations

Process Integration, Engineering, Device Integration +19

Architectural implications and process development of 3-D VLSI Z-axis interconnects using through silicon vias

L.W. Schaper, S. L. Burkett, S. Spiesshoefer et al. · IEEE Transactions on Advanced Packaging · 2005 · 65 citations

Engineering, Silicon Vias, Process Development +21

Perspectives on supercapacitors, pseudocapacitors and batteries

Martin G. Bakker, R. M. Frazier, S. L. Burkett et al. · Nanomaterials and Energy · 2011 · 55 citations

Engineering, Hybrid Capacitor, Renewable Wind +17

Fabrication and electrical performance of through silicon via interconnects filled with a copper/carbon nanotube composite

Ying Feng, S. L. Burkett · Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena · 2015 · 54 citations

Engineering, Mechanical Engineering, Silicon Vias +17