2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

Package level thermal analysis of backside power delivery network (BS-PDN) configurations

Herman Oprins, Jose L. Bohorquez, Bjorn Vermeersch et al. · 2022 · 23 citations

Engineering, Electrical Engineering, Materials Science +17

From 2.5D to 3D Chiplet Systems: Investigation of Thermal Implications with HotSpot 7.0

Jun-Han Han, Xinfei Guo, Kevin Skadron et al. · 2022 · 20 citations

Engineering, Mechanical Engineering, Heat Transfer +16

Drop Shock Performance of SAC-Bi Compared to SnPb

Palash Pranav Vyas, Mohamed El Amine Belhadi, Xin Wei et al. · 2022 · 16 citations

Natural Sciences, Materials Engineering, Materials Science +15

Optimal thermo-mechanical reliability design of 2.5D lidless package

Junbo Yang, Chongyang Cai, Pengcheng Yin et al. · 2022 · 13 citations

Engineering, Materials Engineering, Mechanical Engineering +17

Thermal Modeling and Analysis of High Bandwidth Memory in 2.5D Si-interposer Systems

Taehwan Kim, Jonggyu Lee, Jaechoon Kim et al. · 2022 · 13 citations

Engineering, Electrical Engineering, High-performance Computing +16