Jaechoon Kim

Gallium-based liquid metal alloy incorporating oxide-free copper nanoparticle clusters for high-performance thermal interface materials

Seokkan Ki, Jaehwan Shim, Seungtae Oh et al. · International Journal of Heat and Mass Transfer · 2021 · 71 citations

Materials Engineering, Materials Science, Engineering +6

Advanced Fan-Out Package SI/PI/Thermal Performance Analysis of Novel RDL Packages

Se-Ho You, Seong-Hwan Jeon, Dan Oh et al. · 2018 · 61 citations

Engineering, Computer Architecture, Industry Revolution +20

Liquid cooling module incorporating a metal foam and fin hybrid structure for high power insulated gate bipolar transistors (IGBTs)

Joo‐Young Lee, Seokkan Ki, Donghyun Seo et al. · Applied Thermal Engineering · 2020 · 29 citations

Electrical Engineering, Engineering, Liquid Metal Cooling +8

Study of Advanced Fan-Out Packages for Mobile Applications

Taejoo Hwang, Dan Oh, Eunseok Song et al. · 2018 · 28 citations

Engineering, Energy Efficiency, Computer Architecture +18

Thermal Improvement of HBM with Joint Thermal Resistance Reduction for Scaling 12 Stacks and Beyond

Taehwan Kim, Jonggyu Lee, Youngdeuk Kim et al. · 2023 · 26 citations