Jaechoon Kim

Gallium-based liquid metal alloy incorporating oxide-free copper nanoparticle clusters for high-performance thermal interface materials

Seokkan Ki, Jaehwan Shim, Seungtae Oh et al. · International Journal of Heat and Mass Transfer · 2021 · 75 citations

Natural Sciences, Materials Engineering, Materials Science +12

Advanced Fan-Out Package SI/PI/Thermal Performance Analysis of Novel RDL Packages

Se-Ho You, Seong-Hwan Jeon, Dan Oh et al. · 2018 · 62 citations

Engineering, Electrical Engineering, High-performance Computing +17

Liquid cooling module incorporating a metal foam and fin hybrid structure for high power insulated gate bipolar transistors (IGBTs)

Joo‐Young Lee, Seokkan Ki, Donghyun Seo et al. · Applied Thermal Engineering · 2020 · 30 citations

Engineering, Electrical Engineering, Materials Science +16

Study of Advanced Fan-Out Packages for Mobile Applications

Taejoo Hwang, Dan Oh, Eunseok Song et al. · 2018 · 28 citations

Engineering, Computer Engineering, Electrical Engineering +17

Thermal Improvement of HBM with Joint Thermal Resistance Reduction for Scaling 12 Stacks and Beyond

Taehwan Kim, Jonggyu Lee, Youngdeuk Kim et al. · 2023 · 28 citations

Engineering, High-performance Computing, Materials Science +15