Palash Pranav Vyas

Effect of temperature on the low cycle fatigue properties of BGA solder joints

Xin Wei, Ali Alahmer, Heneen Ali et al. · Microelectronics Reliability · 2023 · 20 citations

Natural Sciences, Materials Engineering, Materials Science +10

Micro Indentation Measurements of the Creep Properties of CABGA Doped Solder Joint

Mohamed El Amine Belhadi, Francy John Akkara, Mohd Aminul Hoque et al. · 2021 · 16 citations

Natural Sciences, Materials Engineering, Materials Science +16

Drop Shock Performance of SAC-Bi Compared to SnPb

Palash Pranav Vyas, Mohamed El Amine Belhadi, Xin Wei et al. · 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) · 2022 · 16 citations

Natural Sciences, Materials Engineering, Materials Science +15

Comparative Drop Shock Reliability Study of SAC-Based Alloys in BGA Assemblies

Palash Pranav Vyas, Ali Alahmer, Seyed Soroosh Alavi et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2024 · 15 citations

Engineering, Materials Engineering, Materials Science +17

Fatigue performance and microstructure of lead-free solder joints in BGA assembly at room temperature

Xin Wei, Sa’d Hamasha, Ali Alahmer et al. · Microelectronics Reliability · 2023 · 11 citations

Natural Sciences, Materials Engineering, Materials Science +13