Stress evaluation of Through-Silicon Vias using micro-infrared photoelasticity and finite element analysis

Experimental Stress Analysis

James W. Dally, W. F. Riley, A. S. Kobayashi · Journal of Applied Mechanics · 1978 · 1.2K citations · Full text

Materials Science, Elementary Elasticity, Plane-elasticity Theory +14

A Detailed Failure Analysis Examination of the Effect of Thermal Cycling on Cu TSV Reliability

Chukwudi Okoro, June W. Lau, Fardad Golshany et al. · IEEE Transactions on Electron Devices · 2014 · 101 citations

Electrical Resistance, Engineering, Cu Tsv Reliability +20

Interfacial Effects During Thermal Cycling of Cu-Filled Through-Silicon Vias (TSV)

Praveen Kumar, I. Dutta, Muhannad S. Bakir · Journal of Electronic Materials · 2011 · 98 citations · Full text

Engineering, Thermal Conductivity, Interconnect (Integrated Circuits) +17

Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test

Xi Liu, Qiao Chen, Venkatesh Sundaram et al. · Microelectronics Reliability · 2012 · 80 citations

Electrical Engineering, Engineering, Hardware Reliability +9

THERMAL STRESSES IN MICROELECTRONICS SUBASSEMBLIES: QUANTITATIVE CHARACTERIZATION USING PHOTOMECHANICS METHODS

Bongtae Han · Journal of Thermal Stresses · 2003 · 68 citations

Engineering, Microscopy, Mechanical Engineering +22