Fabrication and properties of NiO-modified Al2O3 reinforced Sn1.0Ag0.5Cu composite solder and soldering performance

A review: On the development of low melting temperature Pb-free solders

Hiren R. Kotadia, Philip D. Howes, S.H. Mannan · Microelectronics Reliability · 2014 · 465 citations

Natural Sciences, Materials Engineering, Materials Science +11

Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder

L.C. Tsao, Shih‐Ying Chang, Chih-Chen Lee et al. · Materials & Design (1980-2015) · 2010 · 208 citations

Natural Sciences, Materials Engineering, Materials Science +16

The influence of nickel coating on the wettability of aluminum on ceramics

C.A. León‐Patiño, R. A. L. Drew · Composites Part A Applied Science and Manufacturing · 2002 · 133 citations

Natural Sciences, Materials Engineering, Materials Science +11

Dual Role of Multiroom-Structured Sn-Doped NiO Microspheres for Ultrasensitive and Highly Selective Detection of Xylene

Bo Young Kim, Ji‐Wook Yoon, Jin Koo Kim et al. · ACS Applied Materials & Interfaces · 2018 · 110 citations

Natural Sciences, Materials Engineering, Materials Science +15

High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics Applications

Dhafer Abdulameer Shnawah, Suhana Mohd Said, Mohd Faizul Mohd Sabri et al. · Journal of Electronic Materials · 2012 · 100 citations

Engineering, Materials Engineering, Materials Science +12