Enhancement mechanism of Te doping on microstructure, wettability and mechanical properties of Sn–Bi-based solder - Concepedia

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Enhancement mechanism of Te doping on microstructure, wettability and mechanical properties of Sn–Bi-based solder

34

Citations

52

References

2022

Year

Zhuangzhuang Hou, Xiuchen Zhao, Yue Gu, Chengwen Tan, Yongjun Huo, Hong Li, Sujun Shi, Ying Liu

Materials Science and Engineering A

Materials ScienceEngineeringEnhancement MechanismMechanical PropertiesApplied PhysicsMaterial InnovationSn–bi-based SolderHigh-performance Material

References

	Year	Citations

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