Yongjun Huo - Concepedia

Author

Yongjun Huo

University of California, Irvine ORCID

Also Known As

Huo, Yongjun, Yongjun Huo

Publications

534

Citations

H-Index

Concepts

All Affiliations

University of California, Irvine Beijing Institute of Technology Beijing Microelectronics Technology Institute City University of Hong Kong Yale University

About

Yongjun Huo is an author at University of California, Irvine specializing in engineering, materials science, and applied physics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	12	14	341
2	Applied Physics	10	10	256
3	Chemical Engineering	2	2	44
4	Chemistry	2	2	45
5	Natural Sciences	1	1	19

Yongjun Huo

Publications

422

Citations

H-Index

Page 1

	Year	Citations
Wafer-Scale Fabrication of CMOS-Compatible Trapping-Mode Infrared Imagers with Colloidal Quantum Dots Shuo Zhang, Cheng Bi, Tianling Qin, ACS Photonics Photonic SensorOptical MaterialsEngineeringColloidal NanocrystalsOptoelectronic Devices	2023	69
The growth and stress vs. strain characterization of the silver solid solution phase with indium Yongjun Huo, Chin C. Lee Journal of Alloys and Compounds Materials ScienceEngineeringSevere Plastic DeformationApplied PhysicsAlloy Design	2015	42
Enhancement mechanism of Te doping on microstructure, wettability and mechanical properties of Sn–Bi-based solder Zhuangzhuang Hou, Xiuchen Zhao, Yue Gu, Materials Science and Engineering A Materials ScienceEngineeringEnhancement MechanismMechanical PropertiesApplied Physics	2022	34
A reaction study of sulfur vapor with silver and silver–indium solid solution as a tarnishing test method Yongjun Huo, Shao-Wei Fu, Yi-Ling Chen, Journal of Materials Science Materials in Electronics Materials ScienceChemical EngineeringSulfur VaporEngineeringCorrosion	2016	26
Solid solution softening and enhanced ductility in concentrated FCC silver solid solution alloys Yongjun Huo, Jiaqi Wu, Chin C. Lee Materials Science and Engineering A Materials EngineeringMaterials ScienceEngineeringMechanical EngineeringAlloy Design	2018	24
Ultrasonic-enhanced silver‑indium transient liquid phase bonding in advancing rapid and low-temperature packaging Jiaqi Song, Donglin Zhang, Xin Chen, Materials Characterization	2024	22
Atomistic insights into silver-indium solid solution softening mechanism for microelectronics packaging Shuang Zhao, Bing Zheng, Donglin Zhang, Journal of Materials Research and Technology	2023	21
A phase-field model of electrochemical migration for silver-based conductive adhesives Chenrui Cao, Mingkun Yang, Liang Chen, Electrochimica Acta Materials ScienceElectroactive MaterialElectromigration TechniqueEngineeringElectrochemical Migration	2023	20
Study of Anti-Tarnishing Mechanism in Ag-In Binary System by Using Semi-Quantum-Mechanical Approach Yongjun Huo, Jiaqi Wu, Chin C. Lee Journal of The Electrochemical Society Optical MaterialsSilver-indium Binary SystemEngineeringSolid-state ChemistryAbsolute Electronegativity	2017	19
Direct Ag-Ag bonding by in-situ reduction of surface oxides for advanced chip-package interconnection Jiaqi Wu, Yongjun Huo, Chin C. Lee Materialia Materials EngineeringMaterials ScienceElectrical EngineeringDirect Ag-ag BondingEngineering	2018	19

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