Conformal electroless deposition of Cu seed layer on a 60-nm trench pattern modified with a self-assembled monolayer

Won-Kyu Han, Gil-Ho Hwang, Seokjun Hong, Soo-Seok Kim, Chong Seung Yoon, Noh-Jung Kwak, Seung-Jin Yeom, Jae‐Hong Kim, Sung-Goon Kang

Microelectronic Engineering · 2008 · 22 citations · 16 references

Concepts

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