Evaluation of thermomechanical fatigue lifetime of BGA lead-free solder joints and impact of isothermal aging

Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints

Thomas R. Bieler, Hairong Jiang, L.P. Lehman et al. · IEEE Transactions on Components and Packaging Technologies · 2008 · 260 citations

Engineering, Materials Engineering, Materials Science +17

Cyclic twin nucleation in tin-based solder alloys

L.P. Lehman, Yan Xing, Thomas R. Bieler et al. · Acta Materialia · 2010 · 212 citations

Natural Sciences, Materials Engineering, Materials Science +12

Improved predictions of lead free solder joint reliability that include aging effects

Mohammad Motalab, Zijie Cai, Jeffrey C. Suhling et al. · 2012 · 106 citations

Engineering, Materials Engineering, Materials Science +17

Microstructural coarsening in Sn-Ag-based solders and its effects on mechanical properties

I. Dutta, Praveen Kumar, Ganesh Subbarayan · JOM · 2009 · 97 citations

Engineering, Materials Engineering, Materials Science +16

Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Surface Finish Effects

Tae-Kyu Lee, Hongtao Ma, Kuo-Chuan Liu et al. · Journal of Electronic Materials · 2010 · 78 citations

Engineering, Electrical Engineering, Materials Engineering +17