2020 · 10 citations · 13 references
EngineeringComputer EngineeringElectrical EngineeringElectronic MaterialsMicroelectronicsSemiconductor DevicesCarrier TransportDevice ModelingDevice SimulationElectronic Transport ModelingMemory DevicesMemory ModelingCarrier Mobility ModelingFlash MemoryFlash Memory DevicesGrain Boundary EffectsGrain Boundary MobilityGrain Boundary ModelingNand Flash MemoryThree-dimensional Memory
In this paper, mobility model for poly-Si based macaroni structure in 3-D NAND Flash memory is presented. String current was calibrated with technology computer-aided design (TCAD) simulation at room temperature (25°C) with U-shaped trap distribution. Then, unit word line (WL) I-V curve was extracted, and effective mobility was extracted from these data using analytical equation. Mobility model is based on Meyer-Neldel Rule (MNR). We extracted grain boundary barrier height <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$(\varphi_{\mathrm{b}})$</tex> and fitted with our model. Finally, we fitted effective mobility <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$(\mu_{\mathrm{eff}})$</tex> with our model and fitted string current with SPICE simulation.
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Continuous Analytic I–V Model for Surrounding-Gate MOSFETs
David Jiménez, J. Suñé, Lluı́s F. Marsal et al. · IEEE Electron Device Letters · 2004 · 280 citations
Engineering, Electrical Engineering, Electronic Materials +16
The meyer-neldel rule in semiconductors
R. Metselaar, G. Oversluizen · Journal of Solid State Chemistry · 1984 · 81 citations · Full text