Finite element modeling and random vibration analysis of BGA electronic package soldered using lead free solder alloy − Sn-1Cu-1Ni-1Ag

Abstract

As a result of the ban of lead from solder joints, many lead-free solder joints were developed. Most of the electronic equipment is subjected to random vibration. This study develops an analysis methodology based on finite element analysis and vibration tests to predict the failure and fatigue life of the electronic package soldered using Sn-1Cu-1Ni-1Ag under random vibration. A specially designed printed circuit board having ball grid array packages soldered is used in the study. Finite element model is developed in ANSYS and modal analysis was done. The finite element results were validated with experiments (impact test). Random vibration analysis was also done. These results were validated with random vibration experiments. Using the finite element results, it was predicted that the corner solder joints will fail first. It was observed in the random vibration experiment that corner solder joint failed first and the maximum stress generated was 12.8 MPa. Thus, Sn-1Cu-1Ni-1Ag is a promising lead-free solder joint alloy under random vibration combining with its mechanical properties.