Growth mechanism of intermetallic compound and mechanical properties of nickel (Ni) nanoparticle doped low melting temperature tin–bismuth (Sn–Bi) solder

A review: On the development of low melting temperature Pb-free solders

Hiren R. Kotadia, Philip D. Howes, S.H. Mannan · Microelectronics Reliability · 2014 · 465 citations

Natural Sciences, Materials Engineering, Materials Science +11

Structure and properties of lead-free solders bearing micro and nano particles

Liang Zhang, K. N. Tu · Materials Science and Engineering R Reports · 2014 · 322 citations

Natural Sciences, Materials Engineering, Materials Science +14

Interfacial reactions between molten Sn–Bi–X solders and Cu substrates for liquid solder interconnects

Jianfeng Li, S.H. Mannan, M.P. Clode et al. · Acta Materialia · 2006 · 227 citations

Natural Sciences, Materials Engineering, Materials Science +16

Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications

Iver E. Anderson · Journal of Materials Science Materials in Electronics · 2006 · 209 citations

Natural Sciences, Materials Engineering, Materials Science +14

Effect of In on microstructure, thermodynamic characteristic and mechanical properties of Sn–Bi based lead-free solder

Xu Chen, Feng Xue, Jian Zhou et al. · Journal of Alloys and Compounds · 2015 · 166 citations

Natural Sciences, Materials Engineering, Materials Science +13