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Growth mechanism of intermetallic compound and mechanical properties of nickel (Ni) nanoparticle doped low melting temperature tin–bismuth (Sn–Bi) solder

Materials ScienceNanocrystalline MaterialMagnetic PropertiesEngineeringMechanical PropertiesNanomaterialsNanotechnologyApplied PhysicsNanostructure SynthesisGrowth MechanismIntermetallic Compound