Concepedia

Ball Grid Array Packaging

Ball Grid Array Packaging is a type of surface-mount integrated circuit packaging that uses a rectangular or square array of solder balls on the underside of the package to establish electrical and mechanical connections between the semiconductor device and the printed circuit board, distinguished from other packaging types by its high interconnect density and efficient use of board space.

330

Publications

9.9K

Citations

1.1K

Authors

243

Institutions

Publications per year

2017–2026

39

Variants

Ball Grid ArrayBga Packaging

Parents

Publications

330

Embedded Wafer Level Ball Grid Array (eWLB)

Tyler Meyer, G. Ofner, S. Bradl et al. · 2008 · 236 citations

, , +16

Embedded wafer level ball grid array (eWLB)

Markus Brunnbauer, E. F�rgut, G. Beer et al. · 2006 · 187 citations

, , +16

Embedded Wafer Level Ball Grid Array (eWLB)

Markus Brunnbauer, Till Meyer, G. Ofner et al. · 2008 · 160 citations

, , +16

Scallop formation and dissolution of Cu–Sn intermetallic compound during solder reflow

Dejian Ma, W. D. Wang, S. K. Lahiri · Journal of Applied Physics · 2002 · 143 citations

, , +13

Model for BGA and CSP Reliability in Automotive Underhood Applications

Pradeep Lall, Md Nazmul Islam, Naveen K. Singh et al. · IEEE Transactions on Components and Packaging Technologies · 2004 · 137 citations

, , +17

1–5 of 330

Authors

1.1K

  1. PL
    Pradeep Lall

    Auburn University, United States

    10 publications · 431 citations

    10

    h-index

  2. MP
    Michael Pecht

    University of Maryland, College Park, United States

    8 publications · 208 citations

    8

    h-index

  3. KP
    K. Pressel

    Infineon Technologies (Germany), Germany

    7 publications · 301 citations

    7

    h-index

  4. MA
    M.Z. Abdullah

    Universiti Sains Malaysia, Malaysia

    6 publications · 180 citations

    6

    h-index

  5. YC
    Y.C. Chan

    City University of Hong Kong, Hong Kong SAR China

    6 publications · 259 citations

    6

    h-index

1–5 of 1.1K

Institutions

243

  1. Motorola (United States)

    Schaumburg, United States

    14 h-index

    65 publications

    1.4K citations

  2. Advanced Semiconductor Engineering (Taiwan)

    Kaohsiung, Taiwan

    12 h-index

    67 publications

    2K citations

  3. Georgia Institute of Technology

    Atlanta, United States

    11 h-index

    38 publications

    1.2K citations

  4. Infineon Technologies (Germany)

    Munich, Germany

    11 h-index

    44 publications

    4.2K citations

  5. Auburn University

    Auburn, United States

    11 h-index

    55 publications

    2.3K citations

  6. Intel (United States)

    Santa Clara, United States

    11 h-index

    17 publications

    395 citations

  7. Nanyang Technological University

    Singapore, Singapore

    10 h-index

    17 publications

    645 citations

  8. IBM (United States)

    Armonk, United States

    10 h-index

    17 publications

    591 citations

1–8 of 243

Venues

  1. 16

    h-index

  2. IEEE Transactions on Advanced Packaging

    20 publications · 503 citations

    15

    h-index

  3. 14

    h-index

  4. Journal of Electronic Packaging

    10 publications · 286 citations

    10

    h-index

  5. 9

    h-index

1–5