An RDL UBM Structural Design for Solving Ultralow-K Delamination Problem of Cu Pillar Bump Flip Chip BGA Packaging

Thermal Expansion Coefficients of Composite Materials Based on Energy Principles

R. A. Schapery · Journal of Composite Materials · 1968 · 1.2K citations

Engineering, Materials Engineering, Materials Science +17

Reliability Analysis and Design for the Fine-Pitch Flip Chip BGA Packaging

Cheng Peng, C.-M. Liu, Jujian Lin et al. · IEEE Transactions on Components and Packaging Technologies · 2004 · 73 citations

Engineering, Materials Engineering, Packaging Design +14

Copper pillar bump design optimization for lead free flip-chip packaging

K. M. Chen, Te‐Sheng Lin · Journal of Materials Science Materials in Electronics · 2009 · 39 citations

Engineering, Materials Engineering, Materials Science +10

Intermetallic Formation of Copper Pillar With Sn–Ag–Cu for Flip-Chip-On-Module Packaging

Mark E. Huang, Ong Gee Yeow, Chia Yong Poo et al. · IEEE Transactions on Components and Packaging Technologies · 2008 · 31 citations

Natural Sciences, Materials Engineering, Materials Science +13

Below 45nm low-k layer stress minimization guide for high-performance flip-chip packages with copper pillar bumping

Min Woo Lee, Jin Young Kim, Jae Dong Kim et al. · 2010 · 27 citations

Engineering, Materials Engineering, Materials Science +16