Concepedia

Structural Packaging Design

Structural Packaging Design is a branch of packaging design that focuses on the three-dimensional form, material configuration, and functional architecture of a package, distinguishing itself from graphic or conceptual aspects by emphasizing physical integrity, performance, and user interaction.

18

Publications

563

Citations

55

Authors

27

Institutions

Publications per year

2017–2026

3

Variants

Corrugated Packaging DesignFood Packaging DesignRetail Packaging DesignSustainable Packaging Design

Parents

Children

Publications

18

Utilizing in-situ resources and 3D printing structures for a manned Mars mission

Benjamin Kading, Jeremy Straub · Acta Astronautica · 2014 · 139 citations

, , +16

The fundamentals of designing deployable structures with elastic memory composites

Mark S. Lake, D. Campbell · 2004 · 50 citations

, , +16

Thermal management for multifunctional structures

S. P. Rawal, D. M. Barnett, D.E. Martin · IEEE Transactions on Advanced Packaging · 1999 · 40 citations

, , +17

Design and Analysis of a Foldable/Unfoldable Corrugated Architectural Curved Envelop

Francesco Gioia, David Dureisseix, René Motro et al. · Journal of Mechanical Design · 2012 · 36 citations · Full text

, , +15

Inflatable Cylinders for Deployable Space Structures

Mark Schenk, S. Logan Kerr, A. M. Smyth et al. · View · 2013 · 34 citations

, , +15

1–5 of 18

Authors

55

  1. FR
    Fabien Royer

    California Institute of Technology, United States

    2 publications · 55 citations

    2

    h-index

  2. SP
    Sergio Pellegrino

    California Institute of Technology, United States

    2 publications · 55 citations

    2

    h-index

  3. MS
    Mark S. Lake

    Composite Technology Development (United States), United States

    2 publications · 74 citations

    2

    h-index

  4. PS
    Prateek Saxena

    Jawaharlal Nehru University, India

    1 publications · 21 citations

    1

    h-index

  5. MK
    Mamoru Kurashina

    Keio University, Japan

    1 publications · 10 citations

    1

    h-index

1–5 of 55

Institutions

27

  1. Composite Technology Development (United States)

    Lafayette, United States

    2 h-index

    4 publications

    148 citations

  2. California Institute of Technology

    Pasadena, United States

    2 h-index

    7 publications

    206 citations

  3. Université Claude Bernard Lyon 1

    Villeurbanne, France

    1 h-index

    1 publications

    36 citations

  4. Lockheed Martin (United States)

    Bethesda, United States

    1 h-index

    3 publications

    120 citations

  5. Fujitsu (Japan)

    Kawasaki, Japan

    1 h-index

    7 publications

    70 citations

  6. University of North Dakota

    Grand Forks, United States

    1 h-index

    2 publications

    278 citations

  7. Indian Institute of Technology Mandi

    Mandi, India

    1 h-index

    3 publications

    63 citations

  8. ILC Dover (United States)

    Dover, United States

    1 h-index

    3 publications

    39 citations

1–8 of 27

Venues

  1. Journal of Electronic Packaging

    1 publications · 29 citations

    1

    h-index

  2. IEEE Transactions on Advanced Packaging

    1 publications · 40 citations

    1

    h-index

  3. Sustainability

    1 publications · 21 citations

    1

    h-index

  4. 1

    h-index

  5. Journal of Electronic Materials

    JEM · 1 publications · 21 citations

    1

    h-index

1–5