Concepedia

Modular Packaging Design

Modular Packaging Design is a structural packaging design approach that consists of standardized, interchangeable units or components arranged in a systematic configuration to enable adaptability, scalability, and efficient production across diverse product forms and packaging requirements.

9

Publications

216

Citations

39

Authors

14

Institutions

Publications per year

2017–2026

0

Parents

Publications

9

Optical components-the new challenge in packaging

M.R. Matthews, Brian Macdonald, K.R. Preston · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1990 · 55 citations

, , +17

MEMS modular packaging and interfaces

Matthias Schuenemann, K.A. Jam, R. Leutenbauer et al. · 2000 · 30 citations

, , +15

Stacked Modular Package

S. Pienimaa, J. Miettinen, E. Ristolainen · IEEE Transactions on Advanced Packaging · 2004 · 28 citations

, , +16

Free-space parallel multichip interconnection system

Xuezhe Zheng, Philippe Marchand, Dawei Huang et al. · Applied Optics · 2000 · 25 citations

, , +17

A design database for moulded pulp packaging structure

Xiang Ma, A. K. Soh, Borui Wang · Packaging Technology and Science · 2004 · 17 citations

, , +14

1–5 of 9

Authors

39

  1. XZ
    Xuezhe Zheng

    Oracle (United States), United States

    1 publications · 25 citations

    1

    h-index

  2. CF
    Cesare Fantuzzi

    University of Modena and Reggio Emilia, Italy

    1 publications · 17 citations

    1

    h-index

  3. PG
    P. Geldermans

    IBM (United States), United States

    1 publications · 16 citations

    1

    h-index

  4. MJ
    Michael J. Palmer

    Government of Northwest Territories, Canada

    1 publications · 16 citations

    1

    h-index

  5. TJ
    Thomas J. Naughton

    National University of Ireland, Maynooth, Ireland

    1 publications · 13 citations

    1

    h-index

1–5 of 39

Institutions

14

  1. University of Modena and Reggio Emilia

    Modena, Italy

    1 h-index

    3 publications

    51 citations

  2. Nokia (Finland)

    Espoo, Finland

    1 h-index

    1 publications

    28 citations

  3. Oak Ridge National Laboratory

    Oak Ridge, United States

    1 h-index

    3 publications

    39 citations

  4. University of Manchester

    Manchester, United Kingdom

    1 h-index

    1 publications

    17 citations

  5. Fraunhofer Institute for Manufacturing Engineering and Automation

    Stuttgart, Germany

    1 h-index

    2 publications

    60 citations

  6. University of California San Diego

    San Diego, United States

    1 h-index

    4 publications

    100 citations

  7. Fraunhofer-Gesellschaft

    Munich, Germany

    1 h-index

    1 publications

    30 citations

  8. IBM (United States)

    Armonk, United States

    1 h-index

    1 publications

    15 citations

1–8 of 14

Venues

  1. 2

    h-index

  2. Applied Optics

    1 publications · 25 citations

    1

    h-index

  3. IFAC-PapersOnLine

    1 publications · 17 citations

    1

    h-index

  4. IBM Journal of Research and Development

    1 publications · 15 citations

    1

    h-index

  5. IEEE Transactions on Advanced Packaging

    1 publications · 28 citations

    1

    h-index

1–5