R. Leutenbauer

Publications

Citations

H-Index

1993

Active since

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Technische Universität Berlin

Georgia Institute of Technology

R. Leutenbauer is an author at Fraunhofer Institute for Reliability and Microintegration specializing in engineering, electronic packaging, and electrical engineering.

Top concepts

EngineeringElectronic PackagingApplied PhysicsMaterial ScienceMicroelectronicsMicrofabricationComputer EngineeringElectrical Engineering3D PrintingMicrostructure

Publications per year

1993–2002

Publications

MEMS modular packaging and interfaces

Matthias Schuenemann, K.A. Jam, R. Leutenbauer et al. · 2000 · 30 citations

Automotive Industry, Engineering, Microelectromechanical Systems +19

Reliability of thermally aged Au and Sn plated copper leads for TAB inner lead bonding

E. Zakel, R. Leutenbauer, H. Reichl · 2002 · 19 citations

Materials Science, Materials Engineering, Copper Leads +14

Numerical and experimental investigations of large IC flip chip attach

Andreas Schubert, R. Dudek, R. Leutenbauer et al. · 2000 · 13 citations

Flip Chip Technology, Engineering, Vlsi Design +17

Do chip size limits exist for DCA?

Andreas Schubert, R. Dudek, R. Leutenbauer et al. · 1999 · 11 citations

Engineering, Mechanical Engineering, Computer Architecture +17

Selectively released microstructures electroplated into thick positive photoresist

G. Engelmann, O. Ehrmann, R. Leutenbauer et al. · Journal of Micromechanics and Microengineering · 1993 · 10 citations

Materials Science, Electroactive Material, Arbitrary Shape +14

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