Selectively released microstructures electroplated into thick positive photoresist

Abstract

A fabrication process based on sputtering of a thin film plating base, on conventional UV depth lithography, and on electrochemical deposition of gold, makes microstructures of arbitrary shape in the third dimension and of considerable height (up to 80 mu m) and resolution (aspect ratio: about 10) possible. Applications for the fabrication of microstructures are discussed.