Concepedia

Package Geometry Design

Package Geometry Design is a structural packaging design methodology that specifies the three-dimensional form and spatial configuration of a package, distinguishing itself by focusing on the geometric attributes—such as shape, proportions, and dimensional relationships—that influence functionality, material efficiency, ergonomics, and compatibility with manufacturing, distribution, and end-user requirements.

6

Publications

107

Citations

19

Authors

7

Institutions

Publications per year

2017–2026

0

Parents

Publications

6

Geometry of the Shoulder of a Packaging Machine

J. Boersma, Jaap Molenaar · SIAM Review · 1995 · 31 citations · Full text

, , +17

Packaging Considerations for a Surface Acoustic Wave Strain Sensor

Brian Donohoe, Dermot Geraghty, Garret E. O’Donnell et al. · IEEE Sensors Journal · 2011 · 22 citations

, , +14

Evaluation and optimization of package processing and design through solder joint profile prediction

Betty Yeung, T.-Y.T. Lee · IEEE Transactions on Electronics Packaging Manufacturing · 2003 · 19 citations

, , +16

Wide area vertical expansion (WAVE/sup TM/) package design for high speed application: reliability and performance

Young-Gon Kim, I. Mohammed, Byongsu Seol et al. · 2002 · 15 citations

, , +13

Development of C-Line plot technique for the characterization of edge effects in acoustic imaging: A case study using flip chip package geometry

Chean Shen Lee, Guangming Zhang, David M. Harvey et al. · Microelectronics Reliability · 2015 · 10 citations · Full text

, , +11

1–5 of 6

Authors

19

  1. RS
    Rory Stoney

    Trinity College Dublin, Ireland

    1 publications · 22 citations

    1

    h-index

  2. CS
    Chean Shen Lee

    Liverpool John Moores University, United Kingdom

    1 publications · 10 citations

    1

    h-index

  3. JB
    J. Boersma

    Eindhoven University of Technology, Netherlands

    1 publications · 31 citations

    1

    h-index

  4. IM
    I. Mohammed

    The University of Texas at Austin, United States

    1 publications · 15 citations

    1

    h-index

  5. JM
    Jaap Molenaar

    Wageningen University & Research, Netherlands

    1 publications · 31 citations

    1

    h-index

1–5 of 19

Institutions

7

  1. Liverpool John Moores University

    Liverpool, United Kingdom

    1 h-index

    3 publications

    30 citations

  2. NEC (Japan)

    Tokyo, Japan

    1 h-index

    2 publications

    20 citations

  3. Xi'an University of Science and Technology

    Xi'an, China

    1 h-index

    1 publications

    10 citations

  4. Kagoshima University

    Kagoshima, Japan

    1 h-index

    1 publications

    10 citations

  5. Motorola (United States)

    Schaumburg, United States

    1 h-index

    2 publications

    38 citations

  6. Xperi (United States)

    San Jose, United States

    1 h-index

    4 publications

    60 citations

  7. Trinity College Dublin

    Dublin, Ireland

    1 h-index

    4 publications

    88 citations

  8. Tsinghua University

    Beijing, China

    1 publications

    10 citations

1–8 of 7

Venues

  1. IEEE Transactions on Advanced Packaging

    1 publications · 10 citations

    1

    h-index

  2. Microelectronics Reliability

    1 publications · 10 citations

    1

    h-index

  3. SIAM Review

    1 publications · 31 citations

    1

    h-index

  4. IEEE Sensors Journal

    1 publications · 22 citations

    1

    h-index

  5. 1

    h-index

1–5