Concepedia

Package Structural Analysis

Package Structural Analysis is a systematic methodological framework within structural packaging design that evaluates the physical integrity, geometric configuration, and performance characteristics of a package under various mechanical and environmental stresses to optimize its functional and protective capabilities.

42

Publications

1.2K

Citations

135

Authors

57

Institutions

Publications per year

2017–2026

6

Parents

Publications

42

Numerical and experimental investigation of the strength of corrugated board packages

Marco Evangelos Biancolini, C. Brutti · Packaging Technology and Science · 2003 · 120 citations

, , +15

Thermal Deformation Analysis of Various Electronic Packaging Products by Moire´ and Microscopic Moire´ Interferometry

Bongtae Han, Yifan Guo · Journal of Electronic Packaging · 1995 · 118 citations

, , +15

Dynamics of Package Cushioning

R. D. Mindlin · Bell System Technical Journal · 1945 · 100 citations

, , +14

Compression strength of ventilated corrugated paperboard packages: Numerical modelling, experimental validation and effects of vent geometric design

Tobi Fadiji, C.J. Coetzee, Umezuruike Linus Opara · Biosystems Engineering · 2016 · 86 citations

, , +15

Application of finite element analysis to predict the mechanical strength of ventilated corrugated paperboard packaging for handling fresh produce

Tobi Fadiji, Alemayehu Ambaw, C.J. Coetzee et al. · Biosystems Engineering · 2018 · 80 citations

, , +17

1–5 of 42

Authors

135

  1. YL
    Yi‐Shao Lai

    Advanced Semiconductor Engineering (Taiwan), Taiwan

    4 publications · 76 citations

    4

    h-index

  2. CC
    C.J. Coetzee

    Stellenbosch University, South Africa

    3 publications · 185 citations

    3

    h-index

  3. UL
    Umezuruike Linus Opara

    Stellenbosch University, South Africa

    3 publications · 185 citations

    3

    h-index

  4. TF
    Tobi Fadiji

    Stellenbosch University, South Africa

    3 publications · 185 citations

    3

    h-index

  5. CY
    Chang-Lin Yeh

    Advanced Semiconductor Engineering (Taiwan), Taiwan

    3 publications · 64 citations

    3

    h-index

1–5 of 135

Institutions

57

  1. Advanced Semiconductor Engineering (Taiwan)

    Kaohsiung, Taiwan

    4 h-index

    12 publications

    217 citations

  2. Stellenbosch University

    Stellenbosch, South Africa

    3 h-index

    11 publications

    715 citations

  3. Philips (United States)

    Andover, United States

    2 h-index

    2 publications

    33 citations

  4. Jiangnan University

    Wuxi, China

    2 h-index

    5 publications

    85 citations

  5. Jinan University

    Guangzhou, China

    2 h-index

    2 publications

    34 citations

  6. Institute of Microelectronics

    Singapore, Singapore

    2 h-index

    3 publications

    96 citations

  7. University of Rome Tor Vergata

    Rome, Italy

    1 h-index

    2 publications

    240 citations

  8. Chungnam National University

    Daejeon, South Korea

    1 h-index

    1 publications

    10 citations

1–8 of 57

Venues

  1. Microelectronics Reliability

    6 publications · 129 citations

    6

    h-index

  2. Journal of Electronic Packaging

    3 publications · 171 citations

    3

    h-index

  3. Nuclear Engineering and Design

    2 publications · 21 citations

    2

    h-index

  4. Biosystems Engineering

    2 publications · 166 citations

    2

    h-index

  5. Packaging Technology and Science

    2 publications · 139 citations

    2

    h-index

1–5