Publication | Closed Access
Copper pillar bump design optimization for lead free flip-chip packaging
39
Citations
5
References
2009
Year
Materials Science3D Ic ArchitectureChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Chip On BoardChip AttachmentElectronic PackagingMicroelectronics
| Year | Citations | |
|---|---|---|
Page 1
Page 1