Copper pillar bump design optimization for lead free flip-chip packaging

Fracture mechanics: an introduction

Materials Today · 2005 · 430 citations · Full text

Engineering, Materials Engineering, Mechanical Engineering +17

Intermetallic Formation of Copper Pillar With Sn–Ag–Cu for Flip-Chip-On-Module Packaging

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Natural Sciences, Materials Engineering, Materials Science +13

Design Guidance for the Mechanical Reliability of Low-K Flip Chip BGA Package

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Engineering, Electrical Engineering, Materials Engineering +15

Reliability Study on Copper Pillar Bumping with Lead Free Solder

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Engineering, Electrical Engineering, Materials Science +15

Underfill selection for reducing Cu/low-K delamination risk of flip-chip assembly

Tong Wang, Yi‐Shao Lai, Meng-Jen Wang · 2006 · 14 citations

Natural Sciences, Materials Engineering, Materials Science +15