Electrical and spectral characterization of CdS/Si heterojunction prepared by plasma-induced bonding

Surface activated bonding of silicon wafers at room temperature

Hideki Takagi, Kenya Kikuchi, Ryutaro Maeda et al. · Applied Physics Letters · 1996 · 432 citations

Materials Science, Materials Engineering, Room Temperature +14

Wafer fusion: materials issues and device results

A. Black, Aaron R. Hawkins, N.M. Margalit et al. · IEEE Journal of Selected Topics in Quantum Electronics · 1997 · 142 citations

Materials Engineering, Materials Science, Electrical Engineering +15

High gain-bandwidth-product silicon heterointerface photodetector

Aaron R. Hawkins, Weishu Wu, P. Abraham et al. · Applied Physics Letters · 1997 · 112 citations

Photonics, Electrical Engineering, Engineering +10

Self-propagating room-temperature silicon wafer bonding in ultrahigh vacuum

U. Gösele, H. Stenzel, Torsten Martini et al. · Applied Physics Letters · 1995 · 111 citations

Materials Science, Room Temperature, Wafer Scale Processing +11

Bubble-Free Silicon Wafer Bonding in a Non-Cleanroom Environment

R. Stengl, K.-Y. Ahn, U. Gösele · Japanese Journal of Applied Physics · 1988 · 96 citations

Engineering, Mechanical Engineering, Integrated Circuits +16