K.-Y. Ahn

Bubble-Free Silicon Wafer Bonding in a Non-Cleanroom Environment

R. Stengl, K.-Y. Ahn, U. Gösele · Japanese Journal of Applied Physics · 1988 · 96 citations

Engineering, Mechanical Engineering, Integrated Circuits +16

Do oxygen molecules contribute to oxygen diffusion and thermal donor formation in silicon?

U. G�sele, K.-Y. Ahn, B. P. R. Marioton et al. · Applied Physics A · 1989 · 42 citations

Engineering, Surface Science, Applied Physics +8

Stability of interfacial oxide layers during silicon wafer bonding

K.-Y. Ahn, R. Stengl, T. Y. Tan et al. · Journal of Applied Physics · 1989 · 38 citations

Materials Science, Wafer Scale Processing, Engineering +11

Growth, shrinkage, and stability of interfacial oxide layers between directly bonded silicon wafers

K.-Y. Ahn, R. Stengl, T. Y. Tan et al. · Applied Physics A · 1990 · 37 citations

Materials Science, Silicon Wafers, Engineering +8

Tunneling Structures Fabricated by Silicon Wafer Direct Bonding

R. Stengl, K.-Y. Ahn, T. Mii et al. · Japanese Journal of Applied Physics · 1989 · 13 citations

Engineering, Optoelectronic Devices, Integrated Circuits +16