Concepedia

Improving the mechanical performance of Sn57.6Bi0.4Ag solder joints on Au/Ni/Cu pads during aging and electromigration through the addition of tungsten (W) nanoparticle reinforcement

Yi Li, Kaiming Luo, Adeline B.Y. Lim, Zhong Chen, Fengshun Wu, Y.C. Chan

Materials Science and Engineering A · 2016 · 47 citations · 41 references

DOI

Concepts

References

41

Materials science and engineering: An introduction

Clive R. Clayton · Materials Science and Engineering · 1987 · 6K citations

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Physical metallurgy principles

B. L. Mordike · Journal of Nuclear Materials · 1965 · 1.6K citations

Structure and properties of lead-free solders bearing micro and nano particles

Liang Zhang, K. N. Tu · Materials Science and Engineering R Reports · 2014 · 322 citations

, , +14

Failure mechanisms of solder interconnects under current stressing in advanced electronic packages

Y.C. Chan, Daoguo Yang · Progress in Materials Science · 2010 · 275 citations

, , +17

Research advances in nano-composite solders

Jun Shen, Y.C. Chan · Microelectronics Reliability · 2008 · 230 citations

, , +12