Adeline B.Y. Lim

Improving the mechanical performance of Sn57.6Bi0.4Ag solder joints on Au/Ni/Cu pads during aging and electromigration through the addition of tungsten (W) nanoparticle reinforcement

Yi Li, Kaiming Luo, Adeline B.Y. Lim et al. · Materials Science and Engineering A · 2016 · 45 citations

Materials Science, Materials Engineering, Sn57.6bi0.4ag Solder Joints +14

Evaluation of the corrosion performance of Cu–Al intermetallic compounds and the effect of Pd addition

Adeline B.Y. Lim, Wei Jian Neo, Oranna Yauw et al. · Microelectronics Reliability · 2015 · 43 citations

Materials Science, Corrosion Protection, Engineering +5

Phase segregation, interfacial intermetallic growth and electromigration-induced failure in Cu/In–48Sn/Cu solder interconnects under current stressing

Yi Li, Adeline B.Y. Lim, Kaiming Luo et al. · Journal of Alloys and Compounds · 2016 · 38 citations

Materials Science, Electrical Engineering, Electromigration Technique +7

Effect of palladium on the mechanical properties of Cu–Al intermetallic compounds

Adeline B.Y. Lim, Xin Long, Lu Shen et al. · Journal of Alloys and Compounds · 2014 · 24 citations

Materials Science, Materials Engineering, Engineering +6

Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters

Adeline B.Y. Lim, Andrew Chang, Oranna Yauw et al. · Microelectronics Reliability · 2014 · 23 citations

Materials Science, Materials Engineering, Engineering +3