Concepedia

Oranna Yauw

OY

8

Publications

187

Citations

8

H-Index

2010

Active since

Affiliations

Kulicke & Soffa (United States)(Current)

Kulicke & Soffa (Singapore)

Nanyang Technological University

Oranna Yauw is an author at Kulicke & Soffa (United States) specializing in engineering, materials science, and materials engineering.

Top concepts

EngineeringMaterial ScienceElectronic PackagingMaterials EngineeringElectrical EngineeringMicroelectronicsCorrosionApplied PhysicsSurface ScienceMechanical Engineering

Publications per year

2010–2017

8

Publications

8

Evaluation of the corrosion performance of Cu–Al intermetallic compounds and the effect of Pd addition

Adeline B.Y. Lim, Wei Jian Neo, Oranna Yauw et al. · Microelectronics Reliability · 2015 · 43 citations

Materials Science, Corrosion Protection, Engineering +5

Advances in Wire Bonding Technology for 3D Die Stacking and Fan Out Wafer Level Package

Ivy Qin, Oranna Yauw, Gary W. Schulze et al. · 2017 · 42 citations

Engineering, Same Footprint, Interconnect (Integrated Circuits) +16

Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters

Adeline B.Y. Lim, Andrew Chang, Oranna Yauw et al. · Microelectronics Reliability · 2014 · 23 citations

Materials Science, Materials Engineering, Engineering +3

Wire bonding optimization with fine copper wire for volume production

Oranna Yauw, Horst Clauberg, Kuan Fang Lee et al. · 2010 · 21 citations

Materials Science, Electrical Engineering, Engineering +12

Bonding of Ag-alloy wire in LED packages

Jie Wu, Tom Rockey, Oranna Yauw et al. · 2012 · 16 citations

Materials Science, Materials Engineering, Electrical Engineering +11

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