Ivy Qin

Behavior of palladium and its impact on intermetallic growth in palladium-coated Cu wire bonding

Hui Xu, Ivy Qin, Horst Clauberg et al. · Acta Materialia · 2012 · 71 citations

Materials Engineering, Materials Science, Engineering +4

Wire bonding of Cu and Pd coated Cu wire: Bondability, reliability, and IMC formation

Ivy Qin, Hui Xu, Horst Clauberg et al. · 2011 · 52 citations

Materials Science, Materials Engineering, Electrical Engineering +14

Advances in Wire Bonding Technology for 3D Die Stacking and Fan Out Wafer Level Package

Ivy Qin, Oranna Yauw, Gary W. Schulze et al. · 2017 · 42 citations

Engineering, Same Footprint, Interconnect (Integrated Circuits) +16

New observation of nanoscale interfacial evolution in micro Cu–Al wire bonds by in-situ high resolution TEM study

Hui Xu, Ivy Qin, Horst Clauberg et al. · Scripta Materialia · 2016 · 31 citations

Materials Science, Engineering, Nanotechnology +8

Role of process parameters on bondability and pad damage indicators in copper ball bonding

Ivy Qin, A. Shah, Cuong Huynh et al. · Microelectronics Reliability · 2010 · 28 citations

Materials Science, Copper Ball Bonding, Damage Mechanism +13