Cuong Huynh

Wire bonding of Cu and Pd coated Cu wire: Bondability, reliability, and IMC formation

Ivy Qin, Hui Xu, Horst Clauberg et al. · 2011 · 53 citations

Natural Sciences, Materials Engineering, Materials Science +11

Fully printed 3D cube-shaped multiband fractal rectenna for ambient RF energy harvesting

Azamat Bakytbekov, Thang Q. Nguyen, Cuong Huynh et al. · Nano Energy · 2018 · 53 citations

Engineering, Electrical Engineering, Materials Science +14

New Ultra-High-Isolation RF Switch Architecture and Its Use for a 10–38-GHz 0.18-$\mu$m BiCMOS Ultra-Wideband Switch

Cuong Huynh, Cam Nguyen · IEEE Transactions on Microwave Theory and Techniques · 2011 · 38 citations

Engineering, Electrical Engineering, Microelectronics +16

New Technique for Synthesizing Concurrent Dual-Band Impedance-Matching Filtering Networks and ${\hbox{0.18-}}\mu{\hbox {m}}$ SiGe BiCMOS 25.5/37-GHz Concurrent Dual-Band Power Amplifier

Cuong Huynh, Cam Nguyen · IEEE Transactions on Microwave Theory and Techniques · 2013 · 34 citations

Engineering, Electrical Engineering, Analog Electronics +14

Role of process parameters on bondability and pad damage indicators in copper ball bonding

Ivy Qin, A. Shah, Cuong Huynh et al. · Microelectronics Reliability · 2010 · 29 citations

Natural Sciences, Materials Engineering, Materials Science +13