Concepedia

Publication | Closed Access

Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters

DOI

23

Citations

11

References

2014

Year

Adeline B.Y. Lim, Andrew Chang, Oranna Yauw, Bob Chylak, Chee Lip Gan, Zhong Chen
Microelectronics Reliability

References

YearCitations

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