Fengshun Wu

Microstructures and properties of new Sn–Ag–Cu lead-free solder reinforced with Ni-coated graphene nanosheets

Guang Chen, Fengshun Wu, Changqing Liu et al. · Journal of Alloys and Compounds · 2015 · 128 citations · Full text

Materials Science, Nanosheet, Engineering +7

Increasing flexural strength of CO2 cured cement paste by CaCO3 polymorph control

Fengshun Wu, Xujia You, Mingming Wang et al. · Cement and Concrete Composites · 2023 · 111 citations

Materials Science, Cementation, Engineering +7

N, P co-doped graphene-supported monometallic nanoparticles for highly efficient hydrogen evolution by acid electrolysis of water

Fengshun Wu, Li Zeng, An Pei et al. · Journal of Materials Chemistry A · 2024 · 76 citations

Graphene-supported Monometallic Nanoparticles, Engineering, Chemistry +16

Performance of Sn–3.0Ag–0.5Cu composite solder with TiC reinforcement: Physical properties, solderability and microstructural evolution under isothermal ageing

Guang Chen, Hao Peng, Vadim V. Silberschmidt et al. · Journal of Alloys and Compounds · 2016 · 72 citations · Full text

Materials Engineering, Materials Science, Engineering +7

Effect of the size of carbon nanotubes (CNTs) on the microstructure and mechanical strength of CNTs-doped composite Sn0.3Ag0.7Cu-CNTs solder

Ze Zhu, Yan‐Cheong Chan, Zhong Chen et al. · Materials Science and Engineering A · 2018 · 65 citations

Materials Science, Engineering, Carbon-based Material +6