Publication | Closed Access
Reliability Challenges Related to TSV Integration and 3-D Stacking
34
Citations
25
References
2015
Year
EngineeringComputer ArchitectureSystem ReliabilityIntegrated CircuitsReliability EngineeringAdvanced Packaging (Semiconductors)Major Reliability ChallengesModeling And SimulationElectronic PackagingReliability3D Ic ArchitectureElectrical EngineeringHardware ReliabilityComputer EngineeringDevice ReliabilityMicroelectronicsReliability Challenges RelatedCircuit ReliabilityThree-dimensional Integrated Circuits3D Integration
This article identifies four major reliability challenges related to TSV-based 3-D integrated circuits and their solutions that are being developed at imec.
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