3D Vertical interconnects by Copper Direct Bonding

L. DiCioccio, Pierric Gueguen, Patrice Gergaud, Marc Zussy, D. Lafond, Jean Pierre Gonchond, M. Rivoire, Daniel Scevola, L. Clavelier

Materials Research Society Symposium Proceedings · 2008 · 11 citations · 0 references

Concepts