Mechanistic Prediction of the Effect of Microstructural Coarsening on Creep Response of SnAgCu Solder Joints

Threshold stresses for dislocation climb over hard particles: The effect of an attractive interaction

Eduard Arzt, D.S. Wilkinson · Acta Metallurgica · 1986 · 403 citations · Full text

Engineering, Severe Plastic Deformation, Physics +13

The kinetics of dislocation climb over hard particles—II. Effects of an attractive particle-dislocation interaction

Eduard Arzt, Joachim Rösler · Acta Metallurgica · 1988 · 306 citations

Engineering, Impact (Mechanics), Physics +10

Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu

T. Y. Lee, Woon‐Seop Choi, K. N. Tu et al. · Journal of materials research/Pratt's guide to venture capital sources · 2002 · 252 citations

Materials Science, Engineering, Pb-free Solders +8

Ag₃Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys

Donald W. Henderson, Timothy Gosselin, Amit Sarkhel et al. · Journal of materials research/Pratt's guide to venture capital sources · 2002 · 198 citations

Materials Engineering, Materials Science, Engineering +6

Effect of thermo-mechanically induced microstructural coarsening on the evolution of creep response of SnAg-based microelectronic solders

I. Dutta, Dongdong Pan, Robert A. Marks et al. · Materials Science and Engineering A · 2005 · 152 citations

Materials Science, Engineering, Severe Plastic Deformation +14