Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003)

Concepts

EngineeringElectrical EngineeringManufacturing EngineeringElectronic MaterialsMicroelectronicsSemiconductor DevicesChip PackagingMems PackagingMicrowave PackagingPackage DesignPackaging EngineeringPackaging MaterialsAdvanced PackagingDevice PackagingPackage ReliabilityPackaging TechniquesWafer-level Packaging

Abstract

The following topics are dealt with: electrical and thermal design for high performance electronics; mechanical and reliability modeling; materials and assembly processes including lead free and halogen free materials; 3D packaging; MEMS and optical component packaging.

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