IEEE Transactions on Components Hybrids and Manufacturing Technology · 1990 · 13 citations · 14 references
EngineeringMaterials EngineeringMaterials ScienceCeramic MaterialsElectronic MaterialsSemiconductor DevicesChip PackagingDevice CharacterizationDevice ReliabilityPackaging EngineeringSemiconductor ReliabilityWafer BondingDevice AssemblyFlip-chip PackagingLifetimesPackage ReliabilityPackaging ReliabilityPackaging-induced ReliabilityThermal CyclingThermal Cycling Testing
An assessment of flip-chip solder joint reliability for a hybrid device assembly in which a zirconium-titanium-stannate dielectric ceramic chip is flip-chip bonded to a silicon circuit is presented. The device assembly was subjected to severe thermal cycling testing, involving up to 2000 cycles from -55 to +125 degrees C. A range of device solder bond geometries and chip passivation structures were investigated, with devices packaged in both hermetic and nonhermetic enclosures. The results show that flip-chip solder bonds can be extremely reliable under such tests, with no failures being detected in devices that were hermetically packaged. Fatigue failures were observed in nonhermetically packaged devices. Extrapolation to likely operating conditions predicts field lifetimes of between 15 and 300 years.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
14
K. Wakino, Kiichi Minai, Hiroshi Tamura · Journal of the American Ceramic Society · 1984 · 518 citations
Natural Sciences, Materials Engineering, Materials Science +17