Concepedia

Room Temperature Recrystallization of Electroplated Copper Thin Films: Methods and Mechanisms

David C. Walther, M. E. Gross, K. Evans‐Lutterodt, W. L. Brown, Myung-Hoon Oh, Sailesh M. Merchant, P. Naresh

MRS Proceedings · 2000 · 25 citations · 10 references

DOI

Concepts

References

10

Damascene copper electroplating for chip interconnections

P. C. Andricacos, Cyprian Uzoh, John Dukovic et al. · IBM Journal of Research and Development · 1998 · 1.2K citations

, , +16

Mechanisms for microstructure evolution in electroplated copper thin films near room temperature

J. M. E. Harper, C. Cabral, P. C. Andricacos et al. · Journal of Applied Physics · 1999 · 359 citations

, , +17

Electromigration path in Cu thin-film lines

C.‐K. Hu, R. Rosenberg, K. Y. Lee · Applied Physics Letters · 1999 · 329 citations

, , +17

Recrystallization kinetics of electroplated Cu in damascene trenches at room temperature

C. Lingk, M. E. Gross · Journal of Applied Physics · 1998 · 205 citations

, , +16

Two-step room temperature grain growth in electroplated copper

Sywert Brongersma, E. Richard, I. Vervoort et al. · Journal of Applied Physics · 1999 · 96 citations

, , +17