Publication | Closed Access
Impact of LER on BEOL dielectric reliability: A quantitative model and experimental validation
15
Citations
3
References
2009
Year
Unknown Venue
ReliabilityMaterials EngineeringElectrical EngineeringMaterials ScienceEngineeringBeol Dielectric ReliabilityPhysicsExperimental ValidationHardware ReliabilityApplied PhysicsK=2.5 Low-k MaterialQuantitative ModelElectronic PackagingDevice ReliabilityMicroelectronicsFirst TimePhysic Of FailureElectrical Insulation
For the first time we provide a model for describing the LER induced BEOL TDDB lifetime reduction. The model was validated on 50 nm frac12 pitch copper damascene lines embedded into a k=2.5 low-k material.
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