Publication | Closed Access
Integrated CMOS-MEMS with on-chip readout electronics for high-frequency applications
81
Citations
7
References
2006
Year
Commercial Cmos TechnologyElectrical EngineeringCmos-microelectromechanical SystemEngineeringMicrofabricationHigh-frequency DeviceMechanical Structure ReleaseMixed-signal Integrated CircuitNano Electro Mechanical SystemCmos TechnologyMicroelectronicsBeyond CmosMicro-electromechanical SystemOn-chip Readout Electronics
A bridge-shaped first-lateral-mode 60-MHz mechanical resonator, which is monolithically integrated with capacitive CMOS readout electronics, is presented. The resonator is fabricated directly on a commercial CMOS technology using the top metal level as a structural layer. A maskless single-step wet-etching process for mechanical structure release after the standard CMOS integration process is the only postfabrication requirement. Electrical characterization of the electromechanical device demonstrates the feasibility of implementing a CMOS-microelectromechanical system for high-frequency applications using a standard conventional CMOS technology.
| Year | Citations | |
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2004 | 105 | |
2000 | 76 | |
2005 | 66 | |
2005 | 40 | |
2005 | 26 | |
2004 | 24 | |
2000 | 24 |
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