IEEE Electron Device Letters · 2006 · 81 citations · 7 references
Commercial Cmos TechnologyElectrical EngineeringCmos-microelectromechanical SystemEngineeringMicrofabricationHigh-frequency DeviceMechanical Structure ReleaseMixed-signal Integrated CircuitNano Electro Mechanical SystemCmos TechnologyMicroelectronicsBeyond CmosMicro-electromechanical SystemOn-chip Readout Electronics
A bridge-shaped first-lateral-mode 60-MHz mechanical resonator, which is monolithically integrated with capacitive CMOS readout electronics, is presented. The resonator is fabricated directly on a commercial CMOS technology using the top metal level as a structural layer. A maskless single-step wet-etching process for mechanical structure release after the standard CMOS integration process is the only postfabrication requirement. Electrical characterization of the electromechanical device demonstrates the feasibility of implementing a CMOS-microelectromechanical system for high-frequency applications using a standard conventional CMOS technology.
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