J. Cotte - Concepedia

Author

J. Cotte

IBM Research - Thomas J. Watson Research Center

Also Known As

J. COTTE, J. Cotte, J. M. Cotte, J.M. Cotte, John Cotte, John M Cotte, John M. Cotte

Publications

802

Citations

H-Index

Concepts

All Affiliations

IBM Research - Thomas J. Watson Research Center IBM (United States)

About

J. Cotte is an author at IBM Research - Thomas J. Watson Research Center specializing in engineering, microelectronics, and electrical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	14	16	636
2	Electrical Engineering	10	11	469
3	Applied Physics	9	9	247
4	Computer Engineering	3	3	278
5	Chemical Engineering	1	1	49

J. Cotte

Publications

730

Citations

H-Index

Page 1

	Year	Citations
3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias John Knickerbocker, C.S. Patel, Paul Andry, IEEE Journal of Solid-State Circuits EngineeringVlsi DesignDevice IntegrationSilicon Carrier PackageChip Integration	2006	182
Optimization of SiGe HBT technology for high speed analog and mixed-signal applications D.L. Harame, J.M.C. Stork, B.S. Meyerson, EngineeringVlsi DesignHigh Speed AnalogAnalog DesignIntegrated Circuits	2002	73
Ge segregation in SiGe/Si heterostructures and its dependence on deposition technique and growth atmosphere Detlev Grützmacher, T. O. Sedgwick, A. Powell, Applied Physics Letters Materials ScienceEpitaxial GrowthEngineeringPhysicsSurface Science	1993	60
Wafer-scale integration of sacrificial nanofluidic chips for detecting and manipulating single DNA molecules Chao Wang, Sung-Wook Nam, J. Cotte, Nature Communications	2017	51
Subatmospheric chemical vapor deposition ozone/TEOS process for SiO2 trench filling Iqbal Shareef, Gary W. Rubloff, M. Anderle, Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena Materials ScienceChemical EngineeringEngineeringAtmospheric PhotochemistryAtmospheric Science	1995	49
High-efficiency 60 GHZ antenna fabricated using low-cost silicon micromachining techniques D. Liu, C. Jahnes, J. Cotte, Electrical EngineeringSi PackageEngineeringChip-scale PackageAdvanced Packaging (Semiconductors)	2007	33
Pb-free solder alloys for flip chip applications S. K. Kang, Jean Horkans, P. C. Andricacos, Materials EngineeringMaterials ScienceElectrical EngineeringEngineeringAdvanced Packaging (Semiconductors)	2003	32
Growth Rate Enhancement of Heavy n‐ and p‐Type Doped Silicon Deposited by Atmospheric‐Pressure Chemical Vapor Deposition at Low Temperatures P. Agnello, T. O. Sedgwick, J. Cotte Journal of The Electrochemical Society Materials ScienceSemiconductorsSemiconductor TechnologyLow TemperaturesAtmospheric Pressure Reactor	1993	30
Simultaneous fabrication of RF MEMS switches and resonators using copper-based CMOS interconnect manufacturing methods C. Jahnes, J. Cotte, Jennifer L. Lund, EngineeringDevice IntegrationSimultaneous FabricationMechanical EngineeringMicro-electromechanical System	2004	24
113-GHz f/sub T/ graded-base SiGe HBT's E.F. Crabbé, B.S. Meyerson, D.L. Harame, IEEE Transactions on Electron Devices Degrees C-10-s AnnealElectrical EngineeringSemiconductor DeviceEngineeringRf Semiconductor	1993	24

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