J. Cotte

3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias

John Knickerbocker, C.S. Patel, Paul Andry et al. · IEEE Journal of Solid-State Circuits · 2006 · 182 citations

Engineering, Vlsi Design, Device Integration +19

Optimization of SiGe HBT technology for high speed analog and mixed-signal applications

D.L. Harame, J.M.C. Stork, B.S. Meyerson et al. · 2002 · 73 citations

Engineering, Vlsi Design, High Speed Analog +16

Ge segregation in SiGe/Si heterostructures and its dependence on deposition technique and growth atmosphere

Detlev Grützmacher, T. O. Sedgwick, A. Powell et al. · Applied Physics Letters · 1993 · 60 citations

Materials Science, Epitaxial Growth, Engineering +15

Wafer-scale integration of sacrificial nanofluidic chips for detecting and manipulating single DNA molecules

Chao Wang, Sung-Wook Nam, J. Cotte et al. · Nature Communications · 2017 · 51 citations · Full text

Subatmospheric chemical vapor deposition ozone/TEOS process for SiO2 trench filling

Iqbal Shareef, Gary W. Rubloff, M. Anderle et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 1995 · 49 citations

Materials Science, Chemical Engineering, Engineering +14